Thermomechanical analysis of liquid food packaging material in COMSOL Multiphysics
Denna uppsats beskriver simuleringen av ett f¨ orpackningsmaterials mekaniska bete- ende under olika f¨ oruts¨ attningar. Specifikt har simuleringsmjukvaran COMSOL Mul- tiphysics anv¨ ants f¨ or att simulera stora deformationer av kartong och temperaturbe- roende delaminering mellan plastfilm och kartong. Syftet med detta arbete har varit att unders¨ oka om COMSOL kan ˚aterskapa resultaten fr˚an mThis report describes the implementation and evaluation of COMSOL Multiphysics’ ability to simulate the thermomechanical response of a package material. The project was partitioned into three main parts. First, a quantitative assessment of COMSOL’s accuracy in modeling the large strain elastoplastic response of paperboard was con- ducted. Second, an evaluation was performed of COMSOL’s capability
