Damage Analysis of Reactive Ion and Atomic Layer Etched Silicon
Dry etching is one of the most important methods of pattern transfer in nanofabrication. There are many dry etching methods, the most commonly used is reactive ion etching (RIE), that is based on a continuous supply of reactive ions and radicals generated in a radio-frequency (RF) plasma discharge. The RIE approach can be very accurate and may provide high resolution etching, below 10 nm in latera